Menu

India Semiconductor Mission

India used to import nearly every chip it consumed. That’s now changing fast — its first commercial chip fab is racing toward its first wafer, targeted for late 2026.

📑 Contents
Timeline

From Approval to Production

2021-2026: ISM Approved, Micron Goes Live
  • Dec 2021The India Semiconductor Mission (ISM) 1.0 is approved, with an outlay of ₹76,000 crore under MeitY.
  • 28 Feb 2026Micron’s ATMP facility in Sanand, Gujarat becomes the mission’s first operational plant.
Jul 2026: CG Semi’s OSAT Live, Semicon 2.0 Approved
  • 4 Jul 2026CG Semi’s OSAT facility in Sanand becomes India’s third plant to reach commercial production.
  • 15 Jul 2026The Union Cabinet approves Semicon 2.0, with a total outlay of ₹1,27,500 crore. It targets six pillars: design, machines and materials, more fabs, strengthening ATMP/OSAT, R&D, and talent development.
  • Building OnSemicon 2.0 follows ISM 1.0’s 12 approved manufacturing units, worth over ₹1.64 lakh crore combined. Micron, Kaynes, and CG Semi have already begun commercial production.
    Source: PIB, 15 Jul 2026
Must Know

ISM Structure and the Dholera Fab

ISM 1.0 Structure
  • ApprovedThe India Semiconductor Mission (ISM) 1.0 was approved in December 2021, with an outlay of ₹76,000 crore under MeitY. It offers up to 50% fiscal support to approved projects covering fabs, display manufacturing, and chip design.
The Dholera Fab
  • PartnersTata Electronics, partnered with Taiwan’s PSMC, is building India’s first commercial semiconductor fab, in Dholera, Gujarat. This fab targets 28nm-and-below chips, the kind used in cars, industrial controls, and everyday electronics, not cutting-edge processors.
Good to Know

Operational Plants and Targets

The First Operational Plants
  • Micron ATMPMicron’s ATMP (assembly, test, marking, packaging) facility in Sanand, Gujarat, became the mission’s first operational plant.
  • Kaynes OSATKaynes Semicon’s OSAT facility, also in Sanand, focuses on chip testing and packaging, with capacity for about 6 million chips a day.
Self-Sufficiency Targets
  • 2029 / 2035 TargetsIndia targets 70-75% self-sufficiency in domestic chip demand by 2029, and 3nm/2nm manufacturing capability by 2035. ISM 2.0 scales up the mission further, adding fresh funding beyond ISM 1.0’s original outlay.
Current Affairs

📰 Current Affairs

SiCSem's Second Odisha Unit Approved Under Falta SEZ
  • 15 Sep 2026The Unit Approval Committee of Falta Special Economic Zone approved SiCSem Private Limited's second Odisha semiconductor unit, at IDCO Infovalley-II, Jatni Tahasil, Khordha district — the same district as SiCSem's existing compound-semiconductor fab.
  • ScaleThe unit will make Silicon Carbide (SiC) Diodes and MOSFETs, on a proposed investment of ₹3,406 crore, with an expected 1,270 jobs and ₹7,043 crore in export turnover over five years.
  • SourcePIB.
The VIHAAN Chip, and Semicon 2.0’s Six Pillars
  • 15 Aug 2026Chennai-based Aheesa Digital Innovations achieved first-pass silicon success with “VIHAAN,” a broadband networking chip built on the indigenous VEGA microprocessor, backed by the Design Linked Incentive Scheme.
  • VIHAAN SourcePIB.
  • Semicon 2.0Semicon 2.0 rests on six pillars: chip design, machines and materials, more fabs, strengthening ATMP/OSAT units, R&D on advanced nodes, and talent development. Under ISM 1.0, 12 manufacturing units have been approved, with over ₹1.64 lakh crore invested.
  • Semicon 2.0 SourcePIB.
✅ Test Yourself

Question 1 of 1

When was India Semiconductor Mission (ISM) 1.0 approved, and what was its outlay?

Great to Know

Fabrication and Governance Rationale

Named Plants Across States, and Why Fabrication Is the Real Test
  • Four PlantsCG Power (with Renesas and STARS Microelectronics) runs an OSAT facility in Gujarat. Tata Semiconductor Assembly and Test sits at Jagiroad, Assam. The HCL-Foxconn joint venture, India Chip Pvt Ltd, sits in Uttar Pradesh, near Jewar Airport, not Madhya Pradesh as sometimes wrongly stated. SicSem’s compound-semiconductor fab sits at Jatni, near Bhubaneswar, Odisha.
  • ReframeMoving from packaging-and-testing plants to an actual wafer fab is a materially harder step. Fabrication, not ATMP, is the real test of India’s chip ambitions.
Why Mature Nodes First, and the Governance Choice Behind ISM
  • StrategyStarting with mature 28nm nodes rather than cutting-edge 2nm chips is deliberate. Most real demand, cars and appliances, needs mature nodes, not the bleeding edge.
  • StructureHousing ISM inside Digital India Corporation, rather than as a normal ministry department, is a deliberate governance choice. It’s meant to move faster than typical bureaucracy allows.
  • RelatedFor India’s broader indigenous-technology push, see SciTech0036 — Indigenous Technology Development and Make in India.
PYQ

Exam Point of View

Plant Locations Are the Recurring Trap
  • QuestionUPSC CSP 2026 (Q83) asked which plant-location pair was wrongly matched, among CG Power/Gujarat, Tata Semiconductor/Assam, HCL-Foxconn/Madhya Pradesh, and SicSem/Odisha.
  • WhyThe HCL-Foxconn joint venture is actually in Uttar Pradesh, near Jewar Airport, not Madhya Pradesh. Examiners test exact plant-state pairings precisely because they’re easy to mix up when several plants opened around the same time.
  • LinkUPSC CSP 2026, GS Paper I, Q83.
📚 Related Articles
Was this helpful?

Beyond the answer

    Leave a Reply

    [privacy-do-not-sell-link]

    Discover more from MCQ Questions

    Subscribe now to keep reading and get access to the full archive.

    Continue reading

    ✨Ask doubt
    ✨ Ask a Question AI×
    [privacy-do-not-sell-link]